Abstract
Purpose. The modern state with the booty of copper ores andproduction of copper are considered in Ukraine.The task of the article is to carry out a forecast of soil contamination with slurries of printed circuit boards and electroplating. This allows to improve the ecological safety of territories of enterprises producing boards and electroplating. The methodology. The article uses mathematical methods of calculation according to the theory of porous media physicochemical hydrodynamics. This process is described by the equation of movement and conservation of mass of matter in vertical shifts. Findings. The main result of the given work is to improve the method for determining consequences of soil contamination by sludge from PCB and electroplating producing shops. The originality. To avoid the accumulation of sludge in the territory of enterprises we propose to use the technology of spent etching solution regeneration where the selected metal is used as secondary raw materials for copper production and recovered solution is reused for etching printed circuit boards. This way almost no sludge is generated, or their quantity is negligible. Practical implications. The article helps to understand the harmfulness of sludge storage in the enterprise and shows the working method to develop recycling technologies and reuse etching solution during etching PCB.
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