Abstract

An advantage of an RLD (reconfigurable logic device) such as an FPGA (field programmable gate array) is that it can be customized after being manufactured. Due to the aggressive technology scaling, device density is increasing, and it has become a serious problem in power consumption accordingly. In SoC of embedded systems, power gating is one of the major power reduction techniques. However, it is difficult to adopt SRAM-based RLDs because of the high overhead and SRAM being volatile. In this paper, we describe a TEG (test element group) chip of a reconfigurable logic based FeRAM (ferroelectric random access memory) technology. FeRAM brings reconfigurable logic devices the advantage of being a genuine power gater. The chip employs island-style routing architecture and uses a variable grain logic cell as a logic block. A NV-FF (non-volatile flip-flop), which contains FeRAM, a FF, and power-gating control circuits, is used as both configuration memories and FFs in a logic block. The NV-FF can transmit data between FeRAM and FF automatically when a power source is turned off/on. Thus chip-level power gating is possible. The hibernate/restore time is less than 1ms. The chip has 18 × 18 logic blocks and an area of 54.76mm2.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.