Abstract
The aim of the present paper is to investigate the adhesive behavior between a transversely isotropic piezoelectric half-space and a cylinder punch subjected to combined mechanical and electric loads under plane-strain condition. The effect of adhesion is described by using a generalized JKR-model which can account for the non-slip condition in the contact regions. Analytical function theory is employed to find the solution of the resulting singular integral equations. Our analysis shows that the adhesive contact behavior for different types of piezoelectric materials may be quite different. The results obtained in this paper may be helpful to understand the contact mechanics of piezoelectric materials at micro-scale.
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