Abstract
The thermomechanical properties of microelectronic packages can serve as important indicators of reliability. Indeed, it is of great interest in dynamic warpage measurement of deformation and temperature of the local package structure to explore the evolutionary mechanism. In this paper, a full-field warpage characterization measurement method coupled with the infrared information is proposed to quantitatively evaluate the thermomechanical properties of microelectronic devices. A heat source is used to illuminate the calibration board of the infrared image to facilitate multi-camera calibration. After performing a series of image processing procedures, a clear grayscale infrared image of the calibration board was easily obtained, and the calibration between the infrared camera and the optical camera was realized. The thermomechanical properties of the copper thermoelectric cooler were explored after fully verifying the accuracy and error of the measurement. There is an obvious positive correlation between the full-field temperature and warpage of the cooler. The feasibility and validity of the measurement system were validated.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
