Abstract
Abstract The effects of undecylimidazole complex on copper and untreated copper surfaces on polymerization of an epoxy resin were studied using FT-IR reflection-absorption spectroscopy. Catalytic effects have been observed on the polymerization of epoxy resin by the copper/imidazole complex and the copper surface. The epoxy resin showed an appreciable amount of polymerization on the imidazole complex at 100°C on copper. The thickness of the epoxy coating was increased while the imidazole complex dissolved into the bulk resin above this temperature. However, only a small amount of epoxy resin remained on the copper at elevated temperature. This phenomenon was observed only with the imidazole treated copper surface. The epoxy resin without any added catalysts polymerized above 150°C on untreated copper surface. The coating thickness increased rapidly and reached the asymptotic value (2.0 nm) at 150°C. A thicker and random layer was formed at elevated temperatures. The coating thickness was estimated from a calibration curve.
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