Abstract
This paper presents an electrochemical seismic sensor in which paraylene was used as a substrate and insulating layer of micro-fabricated electrodes, enabling the detection of seismic signals with enhanced sensitivities in comparison to silicon-based counterparts. Based on microfabrication, paralene-based electrochemical seismic sensors were fabricated in which the thickness of the insulating spacer was 6.7 μm. Compared to silicon-based counterparts with ~100 μm insulating layers, the parylene-based devices produced higher sensitivities of 490.3 ± 6.1 V/(m/s) vs. 192.2 ± 1.9 V/(m/s) at 0.1 Hz, 4764.4 ± 18 V/(m/s) vs. 318.9 ± 6.5 V/(m/s) at 1 Hz, and 4128.1 ± 38.3 V/(m/s) vs. 254.5 ± 4.2 V/(m/s) at 10 Hz. In addition, the outputs of the parylene vs. silicon devices in response to two transit inputs were compared, producing peak responses of 2.97 V vs. 0.22 V and 2.41 V vs. 0.19 V, respectively. Furthermore, the self-noises of parylene vs. silicon-based devices were compared as follows: −82.3 ± 3.9 dB vs. −90.4 ± 9.4 dB at 0.1 Hz, −75.7 ± 7.3 dB vs. −98.2 ± 9.9 dB at 1 Hz, and −62.4 ± 7.7 dB vs. −91.1 ± 8.1 dB at 10 Hz. The developed parylene-based electrochemical seismic sensors may function as an enabling technique for further detection of seismic motions in various applications.
Highlights
A seismic sensor is a key sensing element widely used in the fields of geophysical exploration and seismic monitoring [1,2,3,4,5]
There are a variety of commercialized seismic sensors such as moving-coil seismic sensors [6,7,8], optical-fiber seismic sensors [9,10], capacitive seismic sensors [11,12], MEMS (Micro-Electro-Mechanical System) seismic sensors [13,14,15], and electrochemical seismic sensors [16,17,18,19,20,21,22,23,24,25,26,27,28,29,30,31]
Significant improvements for motion detections were further conducted in Russia, in which the concept of the electrochemical seismic sensor was introduced [23,24]
Summary
A seismic sensor is a key sensing element widely used in the fields of geophysical exploration and seismic monitoring [1,2,3,4,5]. The problem of low consistency was not addressed until the proposed integrated electrodes by Deng et al in 2014 [17], in which the fabrication of the integrated electrodes got rid of the step of alignments, enhancing the consistency of the seismic sensors. In these micro-fabricated electrochemical seismometers, the sensing electrodes were all fabricated on silicon wafers, with the thickness of the insulating layers in the range of 100 μm, leading to compromised sensitivities.
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