Abstract
AbstractA cyclic voltammetric stripping technique is used to analyse the influence of five parameters on the copper deposition at a rotating platinum ring‐disc electrode. The impact of two pretreatment methods, carbon and electrolytic, and the concentration variations of sulphuric acid, copper sulphate and chloride ions are evaluated in a factorial analysis using the Yates algorithm. Extra information is gathered by electrogravimetric and X‐ray diffraction techniques. The most significant single factors are the copper sulphate and chloride ion concentrations. Carbon treatment with sulphuric acid concentration and electrolytic pretreatment with copper sulphate concentration are important hybrid factors, i. e. with mutual influence.
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