Abstract
In this paper, the BGA solder joint is considered as the object of study. A fatigue life prediction model based on energy conservation law is constructed by reasonable assumptions. Energy-based life prediction model can avoid the analysis of various complex damage mechanisms in fatigue process, and only use energy as a measure. The mechanical response of BGA solder joint under temperature cycling condition is studied by ANSYS finite element analysis software and the stress and strain characteristics of BGA solder joints are obtained. Combining with accelerated test, parameters of BGA solder joint life prediction model based on energy are deduced. According to the figure of data curve fitting, the rationality of the energy-based fatigue life prediction model of BGA solder joints is verified.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
