Abstract
In high speed printed circuit boards and packages, the electromagnetic field propagates in parallel plate field domains, which are one or more dielectric layers sandwiched by two metal shapes in different metal layers. Identifying the field domains and their relationship is the first and crucial step towards a successful analysis. In this letter, a special technology based on the mesh is proposed to find the field domains. Results show that 2D finite element analysis based on the triangular mesh in the field domains is more accurate than finite difference method when comparing with measurement.
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