Abstract
Ball-Grid-Array (BGA) has become one of the most popular packaging techniques in the electronics industry. Coplanarity inspection of BGA solder balls is critical for process and quality control in BGA manufacturing. Currently, the 3D measurement systems for BGA coplanarity inspection are mainly based on laser scanning techniques. However, they suffer from low inspection speed due to the physical line-scanning process. In this paper, a fast and cost-effective 3D measurement system for coplanarity inspection of BGA solder balls is proposed. The proposed system uses an LCD-based phase measuring technique to perform full-field 3D measurement of BGA solder balls with high accuracy. Experiments have shown that the coplanarity measurement of BGA solder balls is very efficient and effective with the proposed system. The measurement repeatability is in the micrometer range. The processing time of the proposed 3D measurement system for an image of 640×480 pixels is less than 2 s on a typical personal computer.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: The International Journal of Advanced Manufacturing Technology
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
