Abstract

A fast, facile one-step process was developed to fabricate superhydrophobic surfaces by electrodepositing copper substrate in an electrolyte containing lanthanum chloride (LaCl3·6H2O), myristic acid (CH3(CH2)12COOH) and ethanol. Morphology and the chemical structure and composition of the superhydrophobic surface were investigated with SEM, FTIR, XRD, and EDX, respectively. The results indicate that the shortest process for constructing superhydrophobic surface is 1min, the maximum contact angle is 165° and rolling angle is less than 2°. In the process of electrodeposition time, structure of cathodic copper surface transforms from the blossom buds into nanostructure assemblies, flowers and then into nanorods. In addition, the method can be extended to effectively prepare a superhydrophobic surface with rare-earth element on general conductive material.

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