Abstract
A new methodology for system-on-chip-level logic-IP-internal electromigration verification is presented in this paper, which significantly improves accuracy by comprehending the impact of the parasitic $RC$ loading and voltage-dependent pin capacitance in the library model. It additionally provides an on-the-fly retargeting capability for reliability constraints by allowing arbitrary specifications of lifetimes, temperatures, voltages, and failure rates, as well as interoperability of the IPs across foundries. The characterization part of the methodology is expedited through the intelligent IP-response modeling. The ultimate benefit of the proposed approach is demonstrated on a 28-nm design by providing an on-the-fly specification of retargeted reliability constraints. The results show a high correlation with SPICE and were obtained with an order of magnitude reduction in the verification runtime.
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