Abstract

Electrically conductive adhesives (ECAs) is used to fix components in the process of chip bonding and surface in the assembly point glue, to form conductive or thermal connection as well as to improve reliability in the packing process of flip chip and Chip Scale Package (CSP), and even to protect components after the completion of assembly. ECAs with the excellent electrical conductivity performance are developed based on hybrid of graphene nanosheets-silver nanowires (GNs-AgNWs) and silver flakes. First, the contral sample only filled with silvers flakes is determined. Then, GNs-AgNWs hybrid nanomaterial was fabricated by a facile ultra sound-assisted method. The AgNWs with graphene have a synergistic effect in improving the electrical conductivity performance. As-prepared hybrid ECA with a low content of 0.5 % of GNs-AgNWs and 69.5 % of silver flakes are higher electrical conductivity performance than those of the control sample. Finally, the hybrid ECA with the optimal formulation will be a promising for application.

Full Text
Published version (Free)

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call