A facile process to fabricate copper/nickel-coated polyurethane composite with high electromagnetic interference shielding performance

Abstract

Modern electronic field needs flexible, light-weight, high-performance electromagnetic interference (EMI) shielding materials with thin thickness, excellent mechanical properties and excellent reliability. The manufacturing of these materials, however, is still challenging. Herein, a facile and fast method that combines coating and electrodeposition is utilized to fabricate high-adhesion copper/nickel layers on graphite (C) filled polyurethane (PU) composite (PU(C)). The silver nanowire (AgNW) conductive network was firstly coated on the PU(C) surface, then the metallization of the PU(C) surface can be rapidly realized owing to the excellent conductivity of the AgNW seed layer. The fabricated PU(C)/AgNW/Cu/Ni composite exhibits ultra-high EMI shielding effectiveness (EMI SE) of around 90 dB with a film thickness and density of only 20 μm and 2.55 g/cm3, respectively. Moreover, EMI shielding performance of the PU(C)/AgNW/Cu/Ni film demonstrates excellent stability after 1000 times bending cycles, and an extended period under high temperature and humidity. Besides, the film also exhibits outstanding toughness and strong adhesion on polyimide and copper substrates after hot pressure. Our work provides an efficacious methodology to fabricate deposited-metal-coated polymer composite with excellent comprehensive performance that shows great potential for applications in EMI shielding.