A facile method for the preparation of furfurylamine based benzoxazine resin with high-frequency low dielectric constants and ultra-low dielectric losses

Abstract

We report the furfurylamine/bisphenol-A based benzoxazine resin that can be used as the polymeric matrix of copper clad laminates for high-frequency applications. The investigation provides a facile and effective route to prepare the partial bio-based benzoxazine monomer in nonpolar solvent with high yield (92%) under the optimum condition. It should be noted that the incorporation of less aromatic furan rings not only increase the reactivity of benzoxazine, but also improve the cross-linking density of polybenzoxazines. Accordingly, the furfurylamine/bisphenol-A based benzoxazine film has the relatively high glass transition temperature (293 °C) and high char yield (50% at 800 °C). In particular, the furfurylamine/bisphenol-A based polybenzoxazine owning relatively low dielectric constants (2.60 ± 0.01, 5 GHz; 2.71 ± 0.01, 10 GHz) and ultra-low dielectric losses (0.007 ± 0.001, 5 GHz; 0.006 ± 0.001, 10 GHz), is suitable for applications in the field of high-frequency communications. Therefore, this work not only provides a simple path for the preparation of lignin based benzoxazine, but also gives some insight into the effects of furan rings on the cross-linking degree and high-frequency dielectric properties of polybenzoxazine.