A Facile Method Combined with Acetic Acid Modification and Electroless Plating to Fabricate Copper-plated Nylon 12 Powder for Antistatic Coating

Zhiping Sun,Chunlan Jiang,Chengmei Gui,Yuqiao Wan

doi:10.37358/rc.21.3.8439

Abstract

Metal particle could deposited on Nylon 12 (PA12) surface using electroless plating with excellent interface and distribution, but the use of noble metal as catalytic site would increase the process cost and restrict its application. In this work, we employed a facile technology combined with acetic acid etching and electroless copper plating to prepare Cu/PA12 composite powder, and it used as conductive filler for antistatic coating was also studied. Results manifested defects (hole and amorphous structure) and amide group established on etched PA12 surface, which would facilitate the destruction of the [Cu-EDTA] structure, and then the reduction of REDOX barrier. As a result, Cu and Cu2O particles deposited on its surface. The downward trend of volume resistivity of antistatic coating appeared the rule of slow-fast-slow. The lowest volume resistivity was about 105 ohm�cm. This means that the dependable technology has great potential application in preparing metal/polymer composite material at a low cost.

Highlights

Electroless plating is free electrochemical deposition method, which is widely used in fabricating metal/polymer composite material
The SEM images manifests the spherical particles deposited on particle could deposited on Nylon 12 (PA12) surface, its size are about 0.2-1 μm
The particles with uniformity and dense microstructure attached on PA12 surface

Summary

Introduction

Electroless plating is free electrochemical deposition method, which is widely used in fabricating metal/polymer composite material. The development of electroless plating has drawn extensive attention mainly because it is a simple and promising method to prepare surface-metallization material [1,2]. Metal particles, such as Ag [3], Cu [4] and Ni [5], in-situ plated on substrate surface with excellent interfacial characterization and dispersion, which meet all the requirements on filler of antistatic coating [6]. The key of the electroless plating reaction is the establishment of catalytic site on polymer surface, so that the plating metal ions were catalyzed reduction metal coating process of formation [7,8]. The surface, at the vacancy edge, has more capacity to absorb incident energy [17]

Methods

Results

Conclusion