Abstract
An innovative controllable way to mitigate intermetallic compounds (IMC) formation during solid-state aging has been proposed. Interlayers consisting of Cu6Sn5 or Cu3Sn were prepared and inserted between Sn solders and Cu substrates. Results show that all interlayers effectively retard formation of IMC, yet the Cu3Sn interlayer has the best effect. After inserting middle Cu3Sn layer, total IMC thickness formed during the aging process is only half of that in samples without interlayer, and growth rate constant of IMC drops to approximately 25% of that in samples without interlayer. In addition, Cu3Sn phase was consumed, in initial period of solid-state aging, to form Cu6Sn5 phase. This slow and difficult transformation inhibited the formation of IMC by virtue of Cu3Sn’s lower Gibbs energy.
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