Abstract
Evaporation of thin liquid films has the potential to sustain significantly high heat fluxes. This cooling mechanism has been studied extensively to create devices capable of handling large static heat loads for electronic cooling. However, significant and sudden variations in the heat loads can result in the dryout of the thin film, which can jeopardize the performance of the cooling system causing irreversible damage to the electronic component. Hence, a mechanism capable of controlling the performance of evaporative cooling is necessary. This study presents a unique strategy that combines a novel evaporator with a vapor compression cycle, whose performance can be varied to address the transient heat loads. The evaporator is designed to take advantage of simultaneously-occurring multiple modes of heat transfer to dissipate large heat fluxes. This study presents a device and system-level analysis to quantify the effect of different system operating conditions that control the overall cooling performance and efficiency.
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