A developed full-field fem analysis combined with ESPI for the investigation of defect evolution in polymer films

Abstract

A full-field finite element method (FEM) analysis combined with electronic speckle pattern interferometry (ESPI) measurement was developed to investigate defect evolution in polymer films. Different from the previous reports, which only compare the ESPI experimental and FEM simulated results at several points or lines, herein the full-field FEM results were exported, subtracted with a continuous distribution. By choosing proper parameters and number of substeps, the simulated and experimental results showed excellent correspondence. Furthermore, the displacement fields vertical to the tensional direction were also presented, and the strain field was preliminarily evaluated. The current method of combination of ESPI and FEM allows for capturing the experimental fringe maps to validate and optimize FEM results simulated, and would give a higher security to structural and mechanical analysis of polymeric materials.