Abstract
This paper provides detailed investigations on void growth and crack-void interaction ahead of a moving crack-tip for a mode I crack in plastically compressible solid. A finite strain elastic-viscoplastic material model with hardening-hardening and hardening-softening-hardening hardness functions is used in the finite element simulation. The plastic compressibility leads to an increased crack opening displacement. The plastic compressibility together with material softening considerably increase stress triaxiality and decrease the void and crack growth. For plastically compressible solids, void growth is more in normal direction to the crack plane and increase in initial void size is accompanied by decrease in the crack and void growth.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
