Abstract
This paper describes a design of hybrid contact detection algorithm of bonding tip in gold wire bonding process. It contains a hybrid design of detection algorithm for capillary contact on pad or lead in the wire bonding process in semiconductor assembly process. The proposed algorithm utilizes both signals of encoder and piezo force sensor that attached on transducer horn holder of z-axis for contact detection. Following sections show a systematic approach to the hybrid design of touch detection algorithm for faster contact detection, which makes it possible to make ultra fine pitch gold wire bonding below 40 um pad pitch with high productivity. The hybrid detection algorithm shows fast and stable performances in wide area of contact searching velocity of bonding tool tip. Real wire bonding experimental results are presented to demonstrate the advantages of the proposed algorithm.
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