Abstract
This paper presents a new cost-effective method to deduce the dielectric properties of substrate materials, which are used in inner layers of low cost printed circuit boards (PCBs). Two different on board structures are applied to estimate the desired complex permittivity in two different ways. On the one hand, a T-resonator based on substrate integrated waveguide technology (SIW) is used, on the other hand a stripline, whereby both are a combination of the outer layer laminate and the underlying prepreg. At first, the scattering parameters of both dielectric structures are measured with a vector network analyzer (VNA). The structures are then simulated with the finite integral method (FI) with all dielectric materials substituted by air. Afterwards, a second simulation with the dielectric constant (DK) of the known dielectric material is necessary. Next, the real part of the complex permittivity is calculated. Finally, the dissipation factor (DF) is calculated.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
