Abstract
The effects of wire bonding parameters on bondability and ball bond reliability have been investigated. Bondability is characterized by ball shear stress (ball shear force per unit area) and ball bond reliability by median time to failure during in-situ ball bond degradation measurements. By introducing the concept of a reduced bonding parameter (RBP), a combination of all bonding parameters, we are able to relate the bonding parameters to bondability and ball bond reliability. With the appropriate RBP, ball shear force, ball shear stress, andball bond reliability appear to be well-behaved functions of the RBP fora wide range of settings. This provides us with simple analytical tool for optimizing bonding parameter windows.
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