A Concept of A Large Scale Multi-Chip-Module in which High Speed Data Transmission Among the Chips is Done by T-Hz Radio Communication

Abstract

A concept of a large scale Multi-Chip-Module with number of Many Core (PE), FPGA and DRAM chips is proposed. There are three major features, (1) very high speed data transmission by T-Hz $(0.1 \sim10$ THz) radio communication chips inside the MCM module for communication among the chips, (2) MLC (Multi Layer Ceramic) or another substrate on which T-Hz radio chips in upper surface side and number of Many Core (PE), FPGA and DRAM chips in lower surface side are connected by C4, (3) T-Hz radio chips also communicate with other MCMs and external I/O devices.