A computer-aided tool for multichip module package design

Abstract

The inherent expertise, complexity and human time involved in finite element modeling and analysis (FEMA) has been currently limited in its application as a tool for early design evaluation. Yet it is possible to overcome these drawbacks and offer engineers a finite element based design tool for rapid design evaluation by simply applying proven artificial intelligence technology, feature based modeling and object oriented techniques to streamline and automate the finite element modeling and analysis as much as possible. Finally, the concepts espoused by Taguchi and others for high quality manufacturing processes can also be applied to advanced package design in a computer based environment. In this manner the design space for advanced package design can be efficiently explored early in the design process and the most promising package configuration in terms of performance and robustness can be selected for prototyping and testing. The authors propose a computer based design tool for multichip modules which embodies these ideas. >