A Comprehensive Study of the Parameters Affecting Magnesium Plating/Stripping Kinetics in Rechargeable Mg Batteries

Abstract

Beyond the lithium ion battery (LIB) technology, alkali and alkaline earth metal (Li, Na, Mg, Ca etc.) anodes boost the prospect of next generation battery chemistry through their highly promising theoretical specific capacities.1,2 Mg metal anode based battery is thus one of the strong contenders for sustainable and alternative rechargeable battery systems, with its natural abundance and eco-friendly resources.3 Despite the first proof-of-concept of a Mg battery established back in 2000,4 its complete rechargeability still remains elusive due to the lack of suitable conventional electrolytes and low mobility of Mg2+ ions in typical intercalation cathodes. Although potentially safer than Li metal (less prone to dendritic growth), reversible Mg electrodeposition in non-aqueous liquid electrolytes is a challenge due to poor salt solubility and formation of ionically blocking surface passivation films.5,6 The study of the interphase between a Mg metal anode and electrolyte is therefore of critical worth as it can dictate stability and reversibility for a particular electrode/electrolyte combination.7 In this work, we explore the role of various parameters, including electrolyte composition, concentration, solvent and substrate nature (various metals and carbon based substrates) and their impact on Mg plating/stripping kinetics and coulombic efficiency. The deposit morphology was investigated via ex situ scanning electron microscopy (SEM) and the reductive stability of the electrolytes was studied by cyclic voltammetry (CV), X-ray Photoelectron Spectroscopy (XPS) and electrochemical quartz crystal microbalance (EQCM). Overall, a comprehensive discussion about the relationship between cation solvation structure, composition and stability of passivation layer (if any) and the degree of reversibility of Mg electrodeposition will be presented. Keywords: Beyond LIB chemistry, metal anode, magnesium, EQCM, plating/stripping.