Abstract
Moisture induced failure is one of the major reliability concerns in electronic packaging. This research provides a comprehensive solution for modeling the moisture induced delamination in electronic packaging during solder reflow. Existing finite element approaches of studying the moisture and vapor pressure induced package delamination issue were discussed, reviewed, summarized and integrated into a systematic approach. This study covered multiple related topics, including diffusion modeling techniques under dynamic thermal loading conditions, fracture mechanics modeling methods for bi-material cracks, and methodologies of applying integrated hygro-thermal-vapor loading conditions. A novel analogy was proposed for applying the combined hygro-thermal-vapor loading in modeling the moisture induced package delamination, which could reduce the users' effort in dealing with the multiple-loading boundary conditions in the fracture mechanics finite element simulation. In the end, the comprehensive finite element approach introduced in this study was implemented to model the moisture induced delamination in a stacked die package during solder reflow.
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