A comprehensive layout of two-dimensional thermal network model for TIM with pulsed heat source

Abstract

Transient thermal impedance (Zth) for repeated pulse is a measure of how the device behaves when any transient power is applied on it. Fluctuation in the junction temperature is caused because of these sources which need a better stabilization mechanism to overcome undesired failure. In general, ‘Zth’ is simulated by means of Cauer or Foster one-dimensional RC network analogy however this lacks generality in addressing the lateral heat propagation in stacked layers. Therefore, the present approach characterizes the importance of two-dimensional RC network modelling which can substantiate its use to capture thermal resistances and associated delays in both dimensions. The 2D transient thermal resistance (Rth) and capacitance (Cth) matrix is obtained numerically at each grid point inside present algorithm and has been explained thoroughly inside the text with plots and contours. Resultant Zth is calculated from these discrete Rth and Cth values in s-domain and finally converted to t-domain with the help of inverse Laplace transformation.