A comprehensive experimental study on the effects of hexagonal boron nitride particle size and loading ratio on thermal and mechanical performance in epoxy composites

Abstract

Harnessing the potential of hexagonal boron nitride (h-BN) in epoxy composites for tailoring thermal conductivity is a promising avenue in materials science. However, achieving balanced enhancements in both in-plane and through-plane directions remains a challenge that requires innovative solutions. The primary objective of this research is to evaluate how thermal and mechanical characteristics of an epoxy matrix are affected by the size and amount of h-BN particles. To achieve this goal, h-BN particles with varying sizes (micro and nano) are incorporated into the epoxy matrix at different weight ratios spanning from 0.5 wt % to 20 wt % using a pre-dispersion technique. The epoxy composites reinforced with h-BN through a molding process exhibits enhanced mechanical and thermal performance in contrast to the pristine epoxy material. During the flexural test, acoustic emission data is collected to identify the initiation and progression of damage within the specimens under testing conditions. The most notable enhancement in thermal conductivity is observed when incorporating 20 wt% of micron-sized h-BN particles. This leads to a remarkable 107% increase in the in-plane direction and an impressive 112% increase in the through-plane direction. These results can be attributed to the formation of a three-dimensional thermally conductive network by the larger h-BN particles, which extends the path of phonon scattering. Furthermore, there are significant improvements in both flexural modulus and tensile modulus. Epoxy composites containing 10 wt% of micron-sized h-BN experiences an approximate 42% increase, while those with 20 wt% of the same particles displays a substantial 47% rise in these properties. This study effectively addresses the challenges associated with tailoring the thermal properties of epoxy composites, opening up new opportunities for applications in various industries, including electronics, aerospace and thermal management systems.