A composite of epoxy resin/copper(II) acetylacetonae as catalyst of copper addition on insulated substrate

Abstract

A novel type of Epoxy Resin (EP)/Copper(II) acetylacetonate (Cu(acac)2) composites is developed and applied to improve electroless plating. This efficient and palladium-free process is based on the EP filled with various mass fractions of Cu(acac)2 via ball milling. The thermal stability of the composite of EP/Cu(acac)2 was performed with corresponding instruments. Moreover, the results of the viscosity and adhesion strength show that the viscosity of sample is positively correlated with the mass fraction of Cu(acac)2 in the composite. On the contrary, the shear strength of sample coated on FR-4 diminishes with the increasing fraction of Cu(acac)2. Results of parametrical optimizing reach the conclusion that under the condition of 50 °C for 15 min by electroless deposition (ELD) of copper, EP containing 40% Cu(acac)2 composites yields the best result.