Abstract

The application of new semiconductor materials deposited on Si substrates via heteroepitaxial growth on oxide buffer layers is one possible way to improve performance and functionality of future Si-based integrated circuits. It is demonstrated how the crystallographic structure of semiconductor-insulator-semiconductor (SIS) structures consisting of a Si(111) substrate, Pr2O3 and Y2O3 insulating buffer layers, and Si cap layer can be characterized by different x-ray techniques. Especially a combination of pole figure measurement with conventional x-ray diffraction scans and reciprocal space mapping is applied to study the in-plane orientation of the oxide and epi-Si layer relative to the Si substrate, the strain state of the individual layers, and the structural perfection of the epi-Si film. Oxide and Si cap layer were grown by molecular beam epitaxy and have the same (111) lattice orientation as the substrate. It is shown that the oxide layers grow in a type B stacking orientation only, while the epilayer exhibits exclusively the same type A orientation as the substrate. Pole figure measurements reveal an unexpected orientation of a small fraction of the epi-Si lattice. This behavior was explained by microtwins as the major defect mechanism in the epi-Si layer. The proposed combination of x-ray techniques allows a relatively fast, integrated, and nondestructive analysis of the epi-Si layer.

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