A comparison of physical and mechanical properties of polyimide films containing different metal ions

Abstract

AbstractMetal ions have been incorporated into linear polyimide films in order to improve the potential of these materials for applications in space. Various metals such as Al, Pd, Ag, Au, and Sn in a variety of chemical states were added to a polyamic acid prepared from 3,3′, 4,4′‐benzophenone tetracarboxylic acid dianhydride and 4,4′‐oxydianiline. Films of the metal ion‐filled polyamic acids were prepared and cured to the corresponding polymides by heating at 300°C in air. The cured films were characterized for such properties as glass transition temperature, electrical conductivity, and thermal stability. Modulii and tensile strengths of the metal‐containing polymide films were obtained at both ambient and elevated temperatures. Comparison of the physical and mechanical properties of these polyimide films as a function of metal additive is made.