Abstract
Materials grown at low temperatures by molecular beam epitaxy techniques have exhibited high resistivity after annealing, and sub-picosecond carrier recombination times. Depending on growth parameters, the nonstoichiometric material can contain a high density of group V antisite defects and precipitates of group V and group III atoms. It is well known that a high density of As antisites and As precipitates formed in GaAs contribute to the high resistance. InP grown at low temperatures was also observed to contain precipitates consisting of both P and In. The latter material however does not exhibit the high resistivity of GaAs. This behavior may be due to the presence of indium or P antisite defects.
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