Abstract

We present a comparative study of the C-face and Si-face of 3C-SiC(111) grown on off-oriented 4H-SiC substrates by the sublimation epitaxy. By the lateral enlargement method, we demonstrate that the high-quality bulk-like C-face 3C-SiC with thickness of ~1 mm can be grown over a large single domain without double positioning boundaries (DPBs), which are known to have a strongly negative impact on the electronic properties of the material. Moreover, the C-face sample exhibits a smoother surface with one unit cell height steps while the surface of the Si-face sample exhibits steps twice as high as on the C-face due to step-bunching. High-resolution XRD and low temperature photoluminescence measurements show that C-face 3C-SiC can reach the same high crystalline quality as the Si-face 3C-SiC. Furthermore, cross-section studies of the C- and Si-face 3C-SiC demonstrate that in both cases an initial homoepitaxial 4H-SiC layer followed by a polytype transition layer are formed prior to the formation and lateral expansion of 3C-SiC layer. However, the transition layer in the C-face sample is extending along the step-flow direction less than that on the Si-face sample, giving rise to a more fairly consistent crystalline quality 3C-SiC epilayer over the whole sample compared to the Si-face 3C-SiC where more defects appeared on the surface at the edge. This facilitates the lateral enlargement of 3C-SiC growth on hexagonal SiC substrates.

Highlights

  • Silicon carbide (SiC) exhibits a range of favorable physical, mechanical and electronic properties making it attractive as an alternative material for next-generation electronic devices [1, 2]

  • We present a comparative study of the C-face and Si-face of 3C-SiC(111) grown on offoriented 4H-SiC substrates by the sublimation epitaxy

  • By the lateral enlargement method, we demonstrate that the high-quality bulk-like C-face 3C-SiC with thickness of ~1 mm can be grown over a large single domain without double positioning boundaries (DPBs), which are known to have a strongly negative impact on the electronic properties of the material

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Summary

Introduction

Silicon carbide (SiC) exhibits a range of favorable physical, mechanical and electronic properties making it attractive as an alternative material for next-generation electronic devices [1, 2]. It has been demonstrated that DPBs can be significantly reduced and even a single domain 3C-SiC can be grown by a lateral enlargement (LE) mechanism on off-oriented hexagonal Si-face SiC substrates via the sublimation epitaxy [26, 27].

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