A Comparative Study of High-Temperature Aluminum Post-Implantation Annealing in 6H- and 4H-SiC, Non-Uniform Temperature Effects

Abstract

4H-and 6H-SiC small samples were implanted by keV Al + ions at room temperature and annealed in an induction heating furnace, at the center of the susceptor, for different temperatures and times in the range 1600-1800°C and 5-60 min, respectively. The implanted layers were amorphous but the SiC crystalline structures were recovered after annealing, as measured by Rutherford Back-Scattering analyses in Channeling geometry. Al + electrical activation determined by sheet resistance and Hall effect measurements increases with the annealing temperature or time, on both polytypes. When whole SiC wafers were annealed in the same induction heating furnace, sheet resistance mapping systematically presented a radial gradient from the center to the periphery of the wafer. The measured linear dependence between sheet resistance and temperature allowed us to rebuild the radial temperature gradient at the crucible-susceptor furnace during the annealing process. Introduction Silicon carbide (SiC) is envisaged as a promising semiconductor material for a wide variety of high-temperature, high-power and high-frequency electronic applications. Ion implantation, an indispensable technique to locally dope silicon carbide still presents many problems in particular for p-type zone creation. High ionization energy of dopants imposes to raise the implanted dose above the amorphization threshold for room temperature implantations. Structure recrystallization and electrical activation of dopants, i.e. their incorporation in active SiC atomic sites, require high temperature annealing, about 1700°C in special configuration, with an overpressure of silicon and carbide. In this work p-type 6H and 4H-SiC layers created by Aluminum (Al) ion implantations followed by high temperature annealings are studied in order to realize efficient p +-n junctions for bipolar power diodes. Dopant electrical activation dependence on the post-implantation annealing conditions is discussed considering the non-uniform temperature at the SiC sample surface during this process.