Abstract

Scaling is aggressively performed for SRAMs to improve the memory integration density. At advanced technology nodes, 6T-SRAM cells built using Symmetrical Double Gate (SDG) MOSFETs are shown to perform better than those built with bulk MOSFETs. Recently the Symmetric Double-Gate Ferroelectric Field Effect Transistor (SDG-FeFET) has generated considerable interest since it has the potential to reduce the Subthreshold Swing (SS) of a transistor below the classical Boltzmann's limit. This was achieved exploiting the negative capacitance behavior of Ferroelectric Material which resulted in reduction of the power and delay of the transistor. In this paper, we simulate a 6T-SRAM cell using SDG-FeFETs and do the comparative study of its performance with SDG MOSFETs as a function of supply voltage and cell ratios. 6T-SRAM cell using SDG-FeFETs is shown to offer significant improvement in the read and write access times and marginal improvement in corresponding static noise margins (SNMs) as well, making it a attractive option for future technology nodes.

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