Abstract
Titanium nitride (TiN), Titanium aluminum nitride (TiAlN), and Titanium aluminum silicon nitride (TiAlSiN) coatings were deposited over Silicon (Si) (100) substrates using chemical vapor deposition (CVD) process at a constant temperature under different N2 flow rate. Scanning electron microscopy (SEM) images reveal a smoother TiN coating surface compared to other coatings. Atomic force microscopy (AFM) indicates enhancement of particle size of TiN and TiAlN coatings with higher N2 gas flow rate. However, the particle size of TiAlSiN found to decrease with a higher N2 flow rate. X-ray diffraction (XRD) results confirm the diffraction phases of TiN, TiAlN and TiAlSiN at (111) and (200) crystal planes. The electrochemical test indicates higher corrosion resistance of TiAlSiN coating as compared to other coatings. Nano-indentation results reveal that TiAlSiN possesses higher hardness (H) and Young's modulus (E) as compared to other coatings.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
