Abstract
This letter presents the design of a Ka-band active integrated antenna in package (AIAiP). A monolithic microwave integrated circuit amplifier based on the GaAs process and a compact patch antenna based on the printed circuit board process are implemented, respectively. Then, the amplifier and antenna are assembled together in a specified package using the wire-bond process. Thus, compared to the traditional solutions, the transmission loss and the size of the proposed AIAiP are significantly reduced. Furthermore, the influence of the bonding wire and the package is taken into account in the design of the amplifier and the antenna, respectively. A good agreement between the simulation and measurement results can be observed. The proposed AIAiP occupies a compact size of 7 × 7 mm2. Meanwhile, it achieves −10-dB impedance bandwidth from 33.4 to 37.2 GHz and a peak gain of 18.9 dBi at 35 GHz. Additionally, the impact of the package size on the antenna performance has been demonstrated for future AIA designers.
Highlights
A CTIVE integrated antenna (AIA) refers to the antenna integrated with one or more active solid-state devices
As reported in [7], a packaged W-band low noise amplifier (LNA) is integrated with a Yagi–Uda antenna based on the printed circuit board (PCB) technology and a 21.2-dBi peak gain is observed at 93 GHz
This letter presents an active integrated antenna in package (AIAiP) for the Ka-band applications
Summary
A CTIVE integrated antenna (AIA) refers to the antenna integrated with one or more active solid-state devices. In [3] and [4], antenna is integrated with an amplifier on a single chip This on-chip AIA is difficult to achieve high gain due to the process limitation. In [5], a Ka-band patch antenna array is integrated with packaged monolithic microwave integrated circuit (MMIC) phase shifters as an AIA using the low-temperature cofired ceramic (LTCC) technology. While in [6], a low noise amplifier (LNA) is packaged with antenna arrays using the LTCC process, and a peak gain of 35 dBi is obtained by this AIA. SONG et al.: COMPACT Ka-BAND ACTIVE INTEGRATED ANTENNA WITH A GaAs AMPLIFIER IN A CERAMIC PACKAGE. To achieve the impedance matching between the chip and the antenna, the influence of the bonding wire has been taken into account in the design of amplifier. The proposed AIAiP is a promising solution to build a miniaturized system for the Ka-band communication and radar applications
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