Abstract
The world's smallest (105/spl times/55/spl times/20 mm) and lightest (130 g) digital still camera has been developed, in which a 330 K pixel complementary metal-oxide-semiconductor (CMOS) image sensor chip is used as an image sensor. The authors have developed a new thinner and smaller image sensor module, called tape automated bonding (TAB) on glass (TOG) module, using the anisotropic conductive paste (ACP) interconnection method. The TOG production process was established by obtaining optimum bonding conditions for both optical glass bonding and CMOS chip bonding to the TAB tape. The bonding conditions including sufficient bonding margins, were mainly studied. The TOG module obtained good imaging properties, It also has a high reliability such as thermal cycle test (-40 to +110/spl deg/C/30 min, 2000 cycles) and the high temperature storage test (60/spl deg/C, 90% RH, 3000 h). The stable production process was confirmed by fabricating an automatic bonding machine.
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