A chip-level process for power switching module integration and packaging

Abstract

A process module, incorporating embedding of multiple power semiconductor chips in a flat ceramic frame and planar metallization interconnect technologies, has been developed to fabricate active power chip scale packages (CSP), multichip modules (MCMs), and integrated power electronics modules (IPEMs). This integrated chips technology features structure compactness and process integrity, compared to other multilevel packaging methods. Thus, power switching module, including controller and driver, sensor and filter, and power switches can be manufactured with a planar integration technology and packaged in 3-D form. An example IPEM, incorporating power factor correction (PFC) and DC/DC switching stages for a distributed power system (DPS) front-end converter application, has been fabricated and characterized. The electrical performance improvement, which includes reduction in parasitics and increase in efficiency, has been demonstrated. Furthermore, a highly functional integrated PFC switching module with embedded capacitor, current sensor and doubled side cooling has been fabricated in an integrated planar process scheme. The obtained experimental results are presented with prototypes.