Abstract
Results from both experimental and numerical studies have already shown the significant package effects on the performance and the reliability of MEMS devices. To enable the theoretical predictions of these packaging effects, a compact joint model of an entire packaged MEMS device is established based on the Cell Library Concept and the Nodal Analysis Method. This modeling methodology greatly simplifies the package-device co-design work compared with the conventional numerical ways, and its precision is guaranteed due to its clarity in the physical nature.
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