Abstract
Due to the temperature and concentration determine the kinetic undercooling of interface growth and nucleation undercooling inside the melt, they play an important role in the solidification microstructure of the alloy. In this paper, the effect of temperature gradient and cooling rate on the dynamic undercooling was studied and the mechanism of the concentration at the solid-liquid interface on the kinetic undercooling during the continuous cooling process was analyzed. A calculation method for the coupling of temperature and concentration during Inconel 718 alloy solidification was developed, which can solve the problem that the concentration and temperature are difficult to be calculated at the same time in the numerical calculation.
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