Abstract
This paper shows a calculating model of the heat transfer coefficients of IC packages in succession on a printed wiring board. Air temperature around any downstream package rises from the inlet air temperature by the thermal wake of the upstream packages. Therefore, the heat transfer coefficient of a downstream package decreases. The air temperature distribution behind a single package was shown in the previous report. By superposing the temperature rise behind the upstream packages, an equation used to predict the heat transfer coefficients of the packages is proposed. The predicted values agree well with the experimental results.
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