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Abstract

Si systems are rapidly evolving toward more efficient, compact parallel architectures as silicon technology evolves toward ultra-large-scale integration (ULSI) and as advanced packaging technologies such as multichip modules (MCMs) are developed. Such advanced microelectronic systems will confront increasingly complex interconnection constraints. Optical interconnections have been suggested as a possible approach to address some of those constraints. However, successful integration of optical interconnections with the advancing microelectronic system technologies will require careful evaluation of practical constraints from the perspective of future microelectronic system technologies. This paper discusses three specific practical issues confronting widespread use of optical interconnects within microelectronic systems, in particular (1) monolithic cointegration of GaAs optoelectronics with high performance, silicon CMOS technologies, (2) optical waveguides on MCMs, and (3) relaxation of physical alignment of components using "intelligent" detector arrays for free space optical interconnections between modules.