Abstract
In this paper, a built-in test circuit for an electrical interconnect test method is proposed to detect an open defect occurring at an interconnect between an IC and a printed circuit board. The test method is based on measuring the supply current of an inverter gate in the test circuit. A time-varying signal is provided to an interconnect as a test signal by the built-in test circuit. In this paper, the test circuit is evaluated by SPICE simulation and by experiments with a prototyping IC. The experimental results reveal that a hard open defect is detectable by the test method in addition to a resistive open defect and a capacitive open one at a test speed of 400 kHz.
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