Abstract
Substrate integrated coaxial line (SICL) is a printed coaxial line inside the circuits, which can be used as chip-to-chip interconnect. Ball grid array (BGA) is widely used in chip packaging. In this paper, a broadband transition is designed to connect the SICL and the BGA chip. Firstly, a prototype formed by an SICL and two quasi-coaxial transitions is designed and fabricated using low temperature co-fired ceramic (LTCC) process. The measured S-parameters of the prototype agree well with simulated results from dc to 67 GHz. Secondly, the measured S-parameters are used in the SICL-transition-BGA simulation model. The hybrid simulation and experimental results show that this transition has good performance in a wide band, and is suitable for multichip modules and system-on-package (SoP) applications.
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