Abstract
Impedance matching is the premise of obtaining a perfect absorbing effect. Through improving the impedance matching condition of the grid-structured absorber by covering a layer of 0.5 mm thick 3D printed disk structure. The bandwidth of the new structure with the reflection loss less than −10 dB is optimized from 5.3–10.2 GHz and 14.8–18 GHz to 5.3–18 GHz. And the total thickness is 3.5 mm. The experimental results further validated the simulation results. The broadband absorption attributes to the synergistic effect of the dielectric loss and magnetic loss. Additionally, the optimized impedance matching is the critical precondition. Due to the 3D printing technology, the printing layer all-dielectric structure can be flexibly fabricated. The tailored strategy of optimizing the impedance matching by the 3D printed all-dielectric plays a guiding role in the realization of broadband absorption.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.