Abstract

Addressing the loss of substrate conductivity after enduring numerous bending stands as a significant challenge for flexible electronics. The primary cause of reduced electrical conductivity in flexible polymer matrices is disorganization of conducting channels by mechanical stress generated during repeated stretching cycles. In this feature article, we extensively reviewed the strategies adopted to control structure formation of conducting networks by optimizing filler and matrix interactions at length scale. Studies, including our recent experiments, indicate that fractal formation of filler assemblies in polymer matrix determines the stability of conducting channels. A wide range of polymers and conducting fillers with different geometries and functional attributes have been analyzed to highlight the intra and intermolecular reinforcing effects to address the shear stresses originating in flexible substrates. Understanding non-bonded interactions between polymers and fillers may lead to the development of desired formulation of conducting inks to print on flexible surfaces for next-generation wearable electronics.

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