A Bond Graph Approach for the Modeling and Simulation of a Buck Converter

Rached Zrafi,Kamel Besbes,Sami Ghedira

doi:10.3390/jlpea8010002

Rached Zrafi, Kamel Besbes + Show 1 more

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https://doi.org/10.3390/jlpea8010002

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Abstract

This paper deals with the modeling of bond graph buck converter systems. The bond graph formalism, which represents a heterogeneous formalism for physical modeling, is used to design a sub-model of a power MOSFET and PiN diode switchers. These bond graph models are based on the device’s electrical elements. The application of these models to a bond graph buck converter permit us to obtain an invariant causal structure when the switch devices change state. This paper shows the usefulness of the bond graph device’s modeling to simulate an implicit bond graph buck converter.

Highlights

A bond graph is a physics-based modeling tool that provides an energy-based topological framework for the modeling of physical systems [1]
Other models use the modulated transformer (MTF) [4,5], where a modulation parameter m is set to 1 for the closed switch state and to 0 for the open switch state, but the causality must be reassigned. An extension of this technique [3], taking account of the resistance of the switcher during the ON mode, consists in combining a Ron resistor to the MTF to represent the non-linear characteristics of the switcher. This method allows for the definition of a single bond graph model that holds for all switch positions
We present the dynamic models, by a bond graph formalism, of the power MOSFET transistor and the PiN diode and their

Summary

Introduction

A bond graph is a physics-based modeling tool that provides an energy-based topological framework for the modeling of physical systems [1]. This is to design bond graph schema mixed with digital application in a buck converter circuit The use of these switcher models leads to unchanged causality control blocks. The bond graph package was developed designed to support mixed-signal systems that contain digital elements and analog elements and to in the VHDL-AMS language. Designed to support mixed-signal systems that contain digital elements and analog elements and describes the buck bond graph design methodology using a power MOSFET and a PiN diode bond to allow the interaction between them. It allows for hierarchy description and the simulation of graph sub-model.

The Buck Bond Graph Model

Power MOSFET

PiN Diode Bond Graph Model Description

Derivation of thethe

Conclusions