Abstract
AbstractA bio‐based allylphenol (eugenol)‐functionalized fluoro‐containing maleimide derived from easily available cyanuric chloride is synthesized, and it is thermally transformed to a cross‐linked polymer. It is found that the polymer displays a 5% weight loss temperature of up to 413 °C, a glass transition temperature (T g) of up to 274 °C, and a thermal expansion coefficient (CTE) of 66.21 ppm °C−1 varying from 50 to 300 °C. The polymer is also found to exhibit lower water uptake (1.06%) than commercial 4,4′‐bismaleimidodiphenylmethane (BMI) resins (3%) and allyl‐modified bismaleimides (4.5%). This polymer is also found to indicate good dielectric properties with a dielectric constant (D k) of below 2.9 and a dissipation factor (D f) of less than 7 × 10−3 for frequencies varying from 40 Hz to 25 MHz. It is reported that, compared to the commercial BMI with CTE of 77.85 ppm °C−1 and D k of 3.50, this eugenol‐functionalized fluoro‐containing maleimide possesses good properties, suggesting that this new maleimide has potential application in the microelectronic industry.
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